Tungsten CMP Slurries
Electronics Ultra-Pure
Electronics Chemical

Tungsten CMP Slurries

Premium electronics grade Tungsten CMP slurries manufactured to meet stringent semiconductor industry specifications for interconnect processing and contact planarization. Provides exceptional tungsten polishing performance with ultra-high purity and consistent formulation for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Tungsten Contact Optimized
  • Superior Via Planarization
  • Low Contamination Levels
  • Consistent Removal Rates
  • Advanced Interconnect Processing
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Technical Specifications

Abrasive Content: 2-15 wt%
Particle Size: 50-150 nm
Removal Rate (W): 1000-3000 Å/min
Selectivity (W:SiO₂): 20:1 to 100:1
pH Range: 2.0-4.0
Metal Impurities: ≤ 0.1 ppm total
Particle Count: ≤ 100 LPCs/mL
Stability: ≥ 21 days
Shelf Life: 6 months at RT
Packaging: 1L, 4L, 20L containers

Applications

Tungsten CMP
Semiconductor Manufacturing
Metal Polishing
Wafer Planarization
Chemical Mechanical Polishing
IC Fabrication
Process Technology
Surface Processing
Process Development
Quality Control
Electronic Manufacturing
R&D Applications

Industry-Specific Grades

DRAVYOM offers specialized tungsten CMP slurry grades tailored for specific electronic applications, ensuring optimal performance and regulatory compliance across diverse manufacturing requirements.

Semiconductor Grade
Abrasive Content: 5-10 wt% Removal Rate: 2000-3000 Å/min Metal Impurities: ≤ 0.01 ppm Application: IC manufacturing
CMP Grade
Abrasive Content: 2-8 wt% Selectivity: High Planarity: Excellent Application: CMP processes
Polishing Grade
Abrasive Content: 10-15 wt% Surface Finish: Smooth Defect Density: Low Application: Metal polishing
Research Grade
Abrasive Content: 2-15 wt% Batch Consistency: ±3% Documentation: Complete Application: R&D work

Quality Standards

DRAVYOM's Tungsten CMP Slurries are manufactured under stringent quality control protocols, meeting international electronics standards including SEMI, ASTM, and ISO specifications. Our electronic-grade production ensures consistent performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI Standards Compliance
Controlled Particle Size
Advanced Quality Testing
Ultra-Low Metal Impurities
Batch-to-Batch Consistency
Traceable Certificate of Analysis
Controlled Environment Storage

Advanced Chemical Properties & Performance

Electronic Grade Tungsten CMP Slurries exhibit exceptional chemical properties essential for semiconductor manufacturing applications. Their ultra-pure composition and precise formulation ensure reliable performance in demanding chemical mechanical planarization processes.

Chemical Properties
Abrasive Type: Silica or alumina based
Particle Size: 20-200 nm
pH Range: 3.0-11.0
Oxidizer Content: H₂O₂, KIO₃, or FeCl₃
Physical Properties
Density: 1.05-1.25 g/cm³
Viscosity: 1.5-10 cP (25°C)
Surface Tension: 40-60 mN/m
Zeta Potential: -40 to +40 mV
CMP Properties
Removal Rate: 50-500 Å/min
Selectivity: W:SiO₂ = 20:1 to 100:1
Planarity: ≤5 nm (90% area)
Defect Density: ≤0.1 defects/cm²
Purity Specifications
Abrasive Purity: ≥99.99%
Metal Impurities: ≤0.1 ppm each
Particle Count: ≤100 particles/mL (>0.5μm)
Organic Impurities: ≤10 ppm
Stability Properties
Shelf Life: 6-12 months
Particle Stability: No agglomeration
Temperature Stability: Stable 15-35°C
Chemical Stability: pH stable ±0.2

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Tungsten CMP Slurries superiority in semiconductor processing applications with exceptional planarization, uniformity, and reproducibility across diverse chemical mechanical polishing processes.

Removal Rate

Rate: 50-500 Å/min controlled

Optimized tungsten removal
Selectivity

Ratio: W:SiO₂ = 20:1 to 100:1

Excellent material selectivity
Planarity

Uniformity: ≤5 nm (90% area)

Superior surface flatness
Temperature Range

Operating: 15-35°C stable

Process temperature control
Defect Density

Defects: ≤0.1 defects/cm²

Ultra-low surface defects
Process Control

Reproducibility: ±3% batch-to-batch

Consistent CMP results

Safety Information

May contain oxidizers and corrosive components that require proper handling protocols. Handle in well-ventilated areas with appropriate protective equipment including chemical-resistant gloves, safety goggles, and protective clothing. Follow all slurry handling protocols and ensure proper spill containment systems.

Oxidizer
Eye Irritant
Skin Contact

Storage & Handling

Store in original containers in cool, dry areas away from heat sources and incompatible materials. Keep containers tightly sealed and maintain proper temperature control. Use only with appropriate slurry handling equipment and follow all CMP slurry safety protocols. Ensure proper mixing before use.

Temperature control (15-35°C)
Dry storage environment
Original packaging
Proper mixing required
Spill containment systems
Secure chemical storage

Chemical Mechanisms & Reaction Pathways

Tungsten CMP slurries exhibit controlled chemical-mechanical polishing chemistry enabling precise material removal with predictable reaction pathways and selective removal rates for advanced semiconductor device fabrication.

Chemical-Mechanical Action

Optimized balance of chemical and mechanical removal

Controlled removal rates and selectivity
Surface Planarization

Excellent global and local planarization capability

Uniform surface topography
Material Selectivity

High selectivity for tungsten vs. barrier materials

Precise endpoint control
Process Control

Consistent performance across die and wafer

Reproducible polishing results

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor facility access with complete documentation packages supporting international standards and semiconductor manufacturing process validations.

SEMI Standards

Semiconductor Equipment and Materials International compliance

CMP Grade

Ultra-high purity specifications for semiconductor CMP

Slurry Grade Quality

Optimized specifications for tungsten polishing applications

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported semiconductor process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor process engineering team provides comprehensive CMP process support, optimization assistance, and technical services to optimize Tungsten CMP Slurries performance in your specific manufacturing applications.

Process Development
  • CMP process optimization support
  • Pressure and velocity optimization
  • Removal rate and selectivity analysis
  • Custom polishing procedures
Analytical Services
  • Surface quality characterization
  • Slurry stability testing
  • Particle size distribution analysis
  • Process monitoring support
Technical Support
  • CMP equipment troubleshooting
  • Process setup and optimization
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Custom formulation development
  • Emergency supply arrangements
  • Point-of-use mixing systems
  • Global semiconductor facility support

Environmental Impact & Sustainability

Our Tungsten CMP Slurries production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor manufacturing operations.

Slurry Recovery

Advanced slurry recovery and recycling systems

Water Treatment

Advanced wastewater treatment and recycling systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for semiconductor waste management

ISO 14001

Environmental management system certified production

Carbon Footprint

Optimized transportation and packaging solutions

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art CMP slurry manufacturing facility employs advanced formulation technology and continuous monitoring systems to ensure consistent Tungsten CMP Slurries quality and performance across all production batches.

Production Process

Advanced formulation and particle control in cleanroom environment

Multi-stage filtration for CMP grade quality
Quality Testing

Comprehensive testing including particle size and chemistry

Dynamic light scattering and polishing performance testing
Quality Systems

ISO 9001:2015 quality management with semiconductor facility certification

Continuous improvement and process validation
Packaging Control

Contamination-free packaging with stability assurance

Slurry stability and shelf-life maintenance

Market Applications & Performance Data

Comprehensive semiconductor manufacturing data demonstrating Tungsten CMP Slurries effectiveness across diverse polishing applications with quantified performance metrics and process validations.

Semiconductor Fabs
Removal Rate: Controlled 1000-5000 Å/min Selectivity: >50:1 tungsten vs. barrier Process Yield: 99.9% device quality
Research Facilities
Surface Quality: <1 nm roughness Reproducibility: >99% batch consistency Innovation: Advanced device support
Manufacturing Lines
Reliability: 99.9% process consistency Throughput: Optimized polishing cycles Cost Efficiency: Reduced slurry consumption

DRAVYOM Competitive Advantages

Superior Performance

Consistently exceeds CMP specifications with optimized selectivity and exceptional polishing performance

Reliable Supply

Guaranteed availability with strategic inventory management and CMP slurry production scheduling

CMP Expertise

Dedicated process engineering team provides polishing development and manufacturing support

Quality Assurance

Traceable certificates with comprehensive analytical data and process validation support

Global Standards

International compliance with SEMI and CMP grade specifications

Partnership Approach

Collaborative relationships with semiconductor facilities and custom formulation development