Solder Pastes & Fluxes
Electronics High-Performance
Electronics Chemical

Solder Pastes & Fluxes (Lead-Free, Low-Temperature)

Premium electronics grade Solder Pastes and Fluxes manufactured to meet stringent semiconductor industry specifications for packaging and electronic assembly. Provides exceptional performance with lead-free and low-temperature formulations for advanced manufacturing processes.

  • Electronics Grade Quality
  • Lead-Free Formulations
  • Low-Temperature Processing
  • Excellent Wetting Properties
  • Consistent Assembly Performance
  • Advanced Packaging Applications
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Technical Specifications

Metal Content: 88-92 wt%
Flux Content: 8-12 wt%
Particle Size: 20-38 μm
Melting Point: 217-220°C
Viscosity: 800-1200 kcps
Working Time: 4-8 hours
Tack Time: ≥ 4 hours
Halide Content: ≤ 0.1 wt%
Shelf Life: 6 months at 2-8°C
Packaging: 30cc, 500g, 1kg containers

Applications

SMT Assembly
BGA Soldering
Fine Pitch Components
Electronic Assembly
PCB Manufacturing
Lead-Free Soldering
Reflow Soldering
Wave Soldering
Repair Applications
Quality Control
Process Development
R&D Applications

Industry-Specific Grades

DRAVYOM offers specialized solder paste and flux grades tailored for specific electronic applications, ensuring optimal performance and regulatory compliance across diverse manufacturing requirements.

No-Clean Grade
Metal Content: 88-90 wt% Flux Type: No-clean Halide Content: ≤ 0.05 wt% Application: SMT assembly
Water-Soluble Grade
Metal Content: 89-91 wt% Flux Type: Water-soluble Activity: High Application: High reliability
Low-Temp Grade
Metal Content: 90-92 wt% Melting Point: 138-143°C Thermal Stability: Good Application: Heat-sensitive components
Research Grade
Metal Content: 88-92 wt% Batch Consistency: ±1% Documentation: Complete Application: R&D work

Quality Standards

DRAVYOM's Solder Pastes and Fluxes are manufactured under stringent quality control protocols, meeting international electronics standards including IPC, JEDEC, and ISO specifications. Our electronic-grade production ensures consistent performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
IPC Standards Compliance
Controlled Particle Size
Advanced Quality Testing
RoHS Compliant
Batch-to-Batch Consistency
Traceable Certificate of Analysis
Cold Chain Storage

Advanced Chemical Properties & Performance

Electronic Grade Solder Pastes and Fluxes exhibit exceptional chemical properties essential for precision electronic assembly applications. The ultra-pure composition and controlled rheology ensure reliable performance in demanding SMT assembly, BGA bonding, and advanced interconnection processes.

Chemical Properties
Alloy Composition: SAC305, SnPb, Lead-free
Flux Type: No-clean, Water-soluble
Activity Level: Low to medium
Halide Content: ≤ 0.05% (w/w)
Physical Properties
Particle Size: Type 3-7 (25-45 μm)
Viscosity (25°C): 800-1200 Pa·s
Metal Loading: 88-92% by weight
Working Life: 8-24 hours
Process Properties
Reflow Profile: SAC: 217-245°C peak
Stencil Life: ≥ 8 hours
Tack Time: 4-12 hours
Print Performance: Excellent definition
Purity Specifications
Metal Purity: ≥ 99.9%
Flux Residue: ≤ 2% by weight
Ionic Content: ≤ 20 μg/cm² NaCl equiv
Water Content: ≤ 0.1%
Reliability Properties
Joint Strength: High mechanical reliability
Thermal Cycling: 1000+ cycles
Corrosion Resistance: Excellent long-term
Electromigration: Low susceptibility

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Solder Pastes and Fluxes superiority in electronic assembly applications with exceptional print quality, reliable joint formation, and robust thermal cycling performance for critical electronic device manufacturing.

Excellent Printability

Sharp stencil definition

Consistent deposits
Long Stencil Life

≥ 8 hours working

Production efficiency
Low Voiding

≤ 10% void content

Reliable joints
Stable Reflow

Wide process window

Robust processing
High Reliability

1000+ thermal cycles

Long-term stability
RoHS Compliant

Lead-free options

Environmental compliance

Safety Information

Solder pastes and fluxes containing metal particles and organic chemicals that may cause skin sensitization and respiratory irritation. Fumes generated during reflow may contain hazardous substances. Handle with appropriate protective equipment including adequate ventilation and avoid inhalation of fumes.

Skin Sensitizer
Fume Hazard
Respiratory Irritant

Storage & Handling

Store in original sealed containers under refrigerated conditions with proper temperature control. Allow thermal equilibration before use and implement paste mixing protocols. Use appropriate dispensing equipment and ensure proper fume extraction during reflow operations.

Refrigerated storage (0-10°C)
Thermal equilibration required
Pre-use mixing protocol
Fume extraction systems

Chemical Mechanisms & Reaction Pathways

Solder pastes and fluxes exhibit controlled metallurgical chemistry enabling predictable solder joint formation with optimized flux activation pathways and quantitative intermetallic growth for electronic assembly.

Flux Activation

Temperature-controlled flux chemistry removes oxides effectively

Predictable surface preparation kinetics
Solder Wetting

Optimized surface tension for controlled solder flow

Enhanced joint formation reliability
Intermetallic Formation

Controlled diffusion creates reliable solder joints

Optimized joint strength development
Thermal Profiles

Temperature-dependent chemistry ensures proper reflow

Controlled metallurgical processes

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global electronics manufacturing facility access with complete documentation packages supporting international standards and electronic assembly process validations.

IPC Standards

Institute for Printed Circuits assembly material standards

JEDEC Standards

Joint Electron Device Engineering Council specifications

RoHS Compliance

Restriction of Hazardous Substances directive compliance

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported electronics assembly process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's electronics assembly engineering team provides comprehensive soldering support, process optimization assistance, and technical services to optimize Solder Pastes and Fluxes performance in your specific manufacturing applications.

Process Development
  • Reflow profile optimization support
  • Stencil design and printing optimization
  • Joint quality analysis and control
  • Custom formulation procedures
Analytical Services
  • Solder joint microstructure analysis
  • Flux residue characterization
  • Wetting angle testing
  • Process monitoring support
Technical Support
  • SMT line troubleshooting
  • Equipment setup and optimization
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Controlled temperature delivery systems
  • Emergency supply arrangements
  • Custom paste formulations
  • Global electronics facility support

Environmental Impact & Sustainability

Our Solder Pastes and Fluxes production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for electronics manufacturing operations.

Waste Minimization

Optimized formulation with minimal waste generation

Lead-Free Options

Environmentally friendly lead-free solder compositions

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for electronics waste management

ISO 14001

Environmental management system certified production

Carbon Footprint

Optimized transportation and packaging solutions

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art electronics materials manufacturing facility employs advanced metallurgical technology and continuous monitoring systems to ensure consistent Solder Pastes and Fluxes quality and performance across all production batches.

Production Process

Advanced powder metallurgy and flux chemistry in controlled environment

Multi-stage mixing and quality control
Quality Testing

Comprehensive analysis including particle size and flux activity

SEM verification and thermal analysis
Quality Systems

ISO 9001:2015 quality management with electronics facility certification

Continuous improvement and process validation
Packaging Control

Temperature-controlled packaging with contamination prevention

Stability assurance and shelf-life optimization

Market Applications & Performance Data

Comprehensive electronics manufacturing data demonstrating Solder Pastes and Fluxes effectiveness across diverse assembly applications with quantified performance metrics and process validations.

Electronics Fabs
Joint Reliability: >99.9% pass rate Voiding: <2% typical Process Yield: 99.9% assembly quality
Research Facilities
Joint Quality: Metallurgically sound Reproducibility: >99% batch consistency Innovation: Next-gen device support
Manufacturing Lines
Reliability: 99.9% process consistency Throughput: Optimized reflow cycles Cost Efficiency: Reduced material consumption

DRAVYOM Competitive Advantages

Superior Performance

Consistently exceeds IPC specifications with optimized metallurgy and exceptional assembly performance

Reliable Supply

Guaranteed availability with strategic inventory management and electronics-grade production scheduling

Assembly Expertise

Dedicated process engineering team provides SMT development and manufacturing support

Quality Assurance

Traceable certificates with comprehensive analytical data and process validation support

Global Standards

International compliance with IPC, JEDEC, and RoHS specifications

Partnership Approach

Collaborative relationships with electronics facilities and custom formulation development