Silicon Dioxide Slurries
Electronics Ultra-Pure
Electronics Chemical

Silicon Dioxide (SiO2) Slurries

Premium electronics grade Silicon Dioxide slurries manufactured to meet stringent semiconductor industry specifications for CMP polishing and dielectric planarization. Provides exceptional polishing performance with ultra-high purity and consistent particle distribution for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Precision CMP Polishing
  • Dielectric Layer Compatible
  • Controlled Particle Size
  • Superior Surface Finish
  • Advanced Semiconductor Applications
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Technical Specifications

SiO₂ Content: 3-50 wt%
Particle Size: 20-200 nm
pH Range: 8.0-12.0
Removal Rate: 1000-5000 Å/min
Selectivity: 10:1 to 100:1
Metal Impurities: ≤ 0.1 ppm total
Particle Count: ≤ 50 LPCs/mL
Stability: ≥ 30 days
Shelf Life: 6 months at RT
Packaging: 1L, 4L, 20L containers

Applications

Chemical Mechanical Polishing
Oxide Polishing
Wafer Planarization
Surface Smoothing
Interlayer Dielectric
Semiconductor Manufacturing
Process Development
Chemical Polishing
Material Research
Quality Control
Electronic Manufacturing
R&D Applications

Industry-Specific Grades

DRAVYOM offers specialized silicon dioxide slurry grades tailored for specific electronic applications, ensuring optimal performance and regulatory compliance across diverse manufacturing requirements.

Semiconductor Grade
SiO₂ Content: 10-30 wt% Particle Size: 20-50 nm Metal Impurities: ≤ 0.01 ppm Application: IC manufacturing
CMP Grade
SiO₂ Content: 5-20 wt% Removal Rate: Controlled Selectivity: High Application: CMP processes
Polishing Grade
SiO₂ Content: 15-40 wt% Surface Finish: Excellent Defect Density: Low Application: Wafer polishing
Research Grade
SiO₂ Content: 3-50 wt% Batch Consistency: ±2% Documentation: Complete Application: R&D work

Quality Standards

DRAVYOM's Silicon Dioxide Slurries are manufactured under stringent quality control protocols, meeting international electronics standards including SEMI, ASTM, and ISO specifications. Our electronic-grade production ensures consistent performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI Standards Compliance
Controlled Particle Size Distribution
Advanced Quality Testing
Ultra-Low Metal Impurities
Batch-to-Batch Consistency
Traceable Certificate of Analysis
Controlled Environment Storage

Advanced Chemical Properties & Performance

Electronic Grade Silicon Dioxide Slurries exhibit exceptional chemical properties essential for precision CMP applications. The ultra-pure composition and controlled particle characteristics ensure reliable performance in demanding planarization and advanced surface preparation processes.

Particle Properties
Primary Particle Size: 20-200 nm controlled
Size Distribution: Narrow, monodisperse
Shape Factor: Spherical particles
Surface Area: 50-400 m²/g
Physical Properties
Solid Content: 5-50% w/w
pH (25°C): 8.5-11.0
Viscosity: < 50 cP
Zeta Potential: -30 to -50 mV
CMP Properties
Removal Rate: Controlled, selective
Planarity: Excellent global planarization
Surface Roughness: < 0.5 nm Ra
Selectivity: Material dependent
Purity Specifications
SiO₂ Purity: ≥ 99.99%
Metal Impurities: ≤ 1 ppm total
Large Particles (>1μm): ≤ 50/mL
Anions: ≤ 10 ppm each
Process Properties
Stability: 6 months at 4°C
Filterability: 0.1 μm compatible
Dilution Stability: Maintains uniformity
Process Temperature: 15-35°C operation

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Silicon Dioxide Slurries superiority in CMP applications with exceptional planarization efficiency, controlled particle size distribution, and reliable performance for critical semiconductor device fabrication.

Controlled Particle Size

20-200 nm range

Precise planarization
Ultra-Low Metals

≤ 1 ppm total

Contamination-free
Excellent Planarity

Global planarization

Superior smoothness
Low Large Particles

≤ 50/mL >1μm

Defect-free processing
Long Stability

6 months shelf life

Process reliability
CMP Ready

Production qualified

Process optimized

Safety Information

Colloidal silica slurries that may cause mild skin and eye irritation and contain alkaline chemicals. Nanoparticles may pose inhalation risks. Handle with appropriate protective equipment including dust masks and chemical-resistant gloves. Ensure adequate ventilation and avoid skin contact.

Mild Irritant
Inhalation Hazard
Alkaline Solution

Storage & Handling

Store in original containers in a cool place with gentle agitation systems to prevent settling. Avoid freezing temperatures and implement appropriate particle filtration systems. Use only with compatible materials and maintain proper slurry distribution systems.

Cool storage (4-25°C)
Gentle agitation systems
Filtration systems
Freeze protection required

Chemical Mechanisms & Reaction Pathways

Silicon dioxide slurries exhibit controlled abrasive particle chemistry enabling precise material removal with predictable polishing mechanisms and quantitative surface finishing for semiconductor manufacturing.

Mechanical Polishing

Controlled abrasive action for precise material removal rates

Predictable surface finishing kinetics
Chemical Etching

Alkaline environment provides controlled chemical assistance

Enhanced material removal selectivity
Particle Interaction

Optimized particle size distribution for uniform polishing

Controlled surface roughness achievement
Surface Chemistry

Colloidal stability ensures consistent slurry performance

Maintained particle dispersion

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor facility access with complete documentation packages supporting international standards and semiconductor manufacturing process validations.

SEMI Standards

Semiconductor Equipment and Materials International compliance

CMP Grade Quality

Chemical mechanical planarization specifications

Electronic Grade

Ultra-high purity specifications for semiconductor manufacturing

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported semiconductor process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor process engineering team provides comprehensive CMP support, process optimization assistance, and technical services to optimize Silicon Dioxide Slurries performance in your specific manufacturing applications.

Process Development
  • CMP process optimization support
  • Pressure and speed optimization
  • Surface finish analysis and control
  • Custom polishing procedures
Analytical Services
  • Surface roughness characterization
  • Particle size distribution analysis
  • Removal rate testing
  • Process monitoring support
Technical Support
  • CMP equipment troubleshooting
  • Slurry distribution system optimization
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Bulk slurry delivery systems
  • Emergency supply arrangements
  • Custom particle size specifications
  • Global semiconductor facility support

Environmental Impact & Sustainability

Our Silicon Dioxide Slurries production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor manufacturing operations.

Waste Minimization

Optimized slurry formulation with minimal waste generation

Water Treatment

Advanced wastewater treatment and recycling systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for semiconductor waste management

ISO 14001

Environmental management system certified production

Carbon Footprint

Optimized transportation and packaging solutions

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art CMP slurry manufacturing facility employs advanced particle control technology and continuous monitoring systems to ensure consistent Silicon Dioxide Slurries quality and performance across all production batches.

Production Process

Advanced particle synthesis and colloidal stabilization

Multi-stage particle size control
Quality Testing

Comprehensive particle analysis including size distribution and stability

Dynamic light scattering and zeta potential analysis
Quality Systems

ISO 9001:2015 quality management with CMP facility certification

Continuous improvement and process validation
Packaging Control

Clean room packaging with contamination prevention systems

Particle integrity and stability assurance

Market Applications & Performance Data

Comprehensive semiconductor manufacturing data demonstrating Silicon Dioxide Slurries effectiveness across diverse CMP applications with quantified performance metrics and process validations.

Semiconductor Fabs
Removal Rate: Controlled 100-500 Å/min Surface Roughness: <0.2 nm RMS Process Yield: 99.9% device quality
Research Facilities
Surface Quality: Atomic-level smoothness Reproducibility: >99% batch consistency Innovation: Advanced device support
Manufacturing Lines
Reliability: 99.9% process consistency Throughput: Optimized polishing cycles Cost Efficiency: Reduced slurry consumption

DRAVYOM Competitive Advantages

Superior Purity

Consistently exceeds CMP grade specifications with ultra-controlled particles and exceptional polishing performance

Reliable Supply

Guaranteed availability with strategic inventory management and CMP slurry production scheduling

CMP Expertise

Dedicated process engineering team provides CMP development and manufacturing support

Quality Assurance

Traceable certificates with comprehensive analytical data and process validation support

Global Standards

International compliance with SEMI and CMP grade specifications

Partnership Approach

Collaborative relationships with semiconductor facilities and custom process development