SC-2 Standard Clean
Electronics Ultra-Pure
Electronics Chemical

SC-2 (Standard Clean 2 - HCl/H2O2/H2O)

Premium electronics grade SC-2 solution manufactured to meet stringent semiconductor industry specifications for wafer cleaning and metallic contamination removal. Provides exceptional cleaning efficiency with ultra-high purity and consistent performance for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Standard Clean 2 Formulation
  • Metallic Contamination Removal
  • Optimized HCl/H2O2/H2O Ratio
  • Consistent Cleaning Performance
  • Advanced Semiconductor Processing
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Technical Specifications

HCl Concentration: 0.25M
H₂O₂ Concentration: 0.5M
pH Range: 0.5-1.5
Metal Impurities: ≤ 0.1 ppm total
Particle Count: ≤ 10 per mL
Conductivity: ≤ 5 μS/cm
Cleaning Temperature: 65-75°C
Cleaning Time: 5-10 minutes
Shelf Life: 6 months at RT
Packaging: 1L, 4L, 20L containers

Applications

Wafer Cleaning
Standard Clean Process
Metal Removal
Organic Removal
Surface Preparation
Semiconductor Processing
Process Equipment
Chemical Cleaning
Pre-Process Cleaning
Quality Control
Electronic Manufacturing
R&D Applications

Industry-Specific Grades

DRAVYOM offers specialized SC2 Standard Clean solution grades tailored for specific electronic applications, ensuring optimal performance and regulatory compliance across diverse manufacturing requirements.

Semiconductor Grade
HCl: 0.25M ±0.01 H₂O₂: 0.5M ±0.02 Metal Impurities: ≤ 0.01 ppm Application: IC manufacturing
Standard Grade
HCl: 0.25M ±0.02 H₂O₂: 0.5M ±0.03 Cleaning Efficiency: ≥99% Application: Standard processes
High Purity Grade
HCl: 0.25M ±0.005 H₂O₂: 0.5M ±0.01 Particle Count: ≤ 5 per mL Application: Critical cleaning
Research Grade
HCl: 0.25M ±0.03 H₂O₂: 0.5M ±0.05 Documentation: Complete Application: R&D work

Quality Standards

DRAVYOM's SC2 Standard Clean Solution is manufactured under stringent quality control protocols, meeting international electronics standards including SEMI, ASTM, and ISO specifications. Our electronic-grade production ensures consistent performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI Standards Compliance
Precise Concentration Control
Advanced Quality Testing
Ultra-Low Metal Impurities
Batch-to-Batch Consistency
Traceable Certificate of Analysis
Controlled Environment Storage

Advanced Chemical Properties & Performance

Electronic Grade SC2 Standard Clean exhibits exceptional chemical properties essential for precision silicon wafer cleaning applications. The ultra-pure composition and controlled chemistry ensure reliable performance in demanding metal contamination removal and surface preparation processes.

Chemical Properties
Composition: HCl:H₂O₂:H₂O (1:1:6)
pH (25°C): 0.5-1.0
Oxidation Potential: Strong oxidizing
Cleaning Mechanism: Metal dissolution
Physical Properties
Operating Temperature: 70-80°C optimal
Solution Stability: 1-2 hours at 80°C
Vapor Generation: HCl and O₂ evolution
Density (25°C): 1.01-1.03 g/mL
Cleaning Properties
Metal Removal: Complete dissolution
Oxide Removal: Selective etching
Surface Passivation: Hydrogen termination
Cleaning Efficiency: ≥ 99.9% metal removal
Purity Specifications
HCl Purity: ≥ 37% electronic grade
H₂O₂ Purity: ≥ 30% electronic grade
Metal Impurities: ≤ 1 ppb total
Water Quality: 18.2 MΩ·cm resistivity
Process Properties
Cleaning Time: 10-15 minutes
Etch Rate (SiO₂): Controlled selective
Selectivity: High for metals
Compatibility: CMOS process

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade SC2 Standard Clean superiority in silicon wafer cleaning applications with exceptional metal removal efficiency, controlled surface passivation, and reliable performance for critical semiconductor device fabrication.

Metal Removal

≥ 99.9% efficiency

Complete dissolution
Ultra-Low Metals

≤ 1 ppb total

Contamination-free
Surface Passivation

Hydrogen termination

Controlled surface
Selective Etching

Controlled oxide removal

Precise processing
Temperature Control

70-80°C operation

Optimized cleaning
CMOS Compatible

Process qualified

Device fabrication

Safety Information

Highly corrosive acidic oxidizing solution that causes severe burns and generates toxic chlorine gas. May cause severe respiratory damage and systemic toxicity. Handle with extreme caution using appropriate protective equipment including acid-resistant materials and ensure comprehensive ventilation and gas monitoring systems.

Highly Corrosive
Toxic Gas Formation
Strong Oxidizer

Storage & Handling

Prepare fresh solutions before use due to limited stability. Store individual components separately in cool, well-ventilated areas with appropriate safety systems. Use only with acid-resistant equipment and ensure comprehensive gas monitoring and emergency response procedures.

Fresh preparation required
Gas monitoring systems
Excellent ventilation
Acid-resistant equipment

Chemical Mechanisms & Reaction Pathways

SC2 Standard Clean exhibits strong acidic properties through hydrochloric acid activation of hydrogen peroxide, creating controlled silicon oxide etching with predictable reaction pathways and quantitative surface preparation.

Oxide Etching

HCl activates H₂O₂ for controlled silicon dioxide removal

Selective etching for surface cleaning
Metal Dissolution

Acidic environment dissolves metal oxides and hydroxides

Complete metal contamination removal
Surface Termination

Formation of hydrogen-terminated silicon surfaces

Hydrophobic surface preparation
Chlorine Chemistry

Chloride ions facilitate metal complex formation

Enhanced metal removal efficiency

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor facility access with complete documentation packages supporting international standards and semiconductor manufacturing process validations.

SEMI Standards

Semiconductor Equipment and Materials International compliance

ASTM Standards

American Society for Testing and Materials semiconductor specifications

Electronic Grade

Ultra-high purity specifications for semiconductor manufacturing

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported semiconductor process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor process engineering team provides comprehensive method support, process optimization assistance, and technical services to optimize SC2 Standard Clean performance in your specific manufacturing applications.

Process Development
  • Etching process optimization support
  • Temperature and concentration optimization
  • Metal contamination analysis and control
  • Custom etching procedures
Analytical Services
  • Surface oxide thickness analysis
  • Metal contamination testing
  • Surface termination characterization
  • Process monitoring support
Technical Support
  • Process troubleshooting consultation
  • Equipment setup and optimization
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Just-in-time delivery systems
  • Emergency supply arrangements
  • Custom packaging and volumes
  • Global semiconductor facility support

Environmental Impact & Sustainability

Our SC2 Standard Clean production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor manufacturing operations.

Waste Minimization

Optimized formulation with minimal waste generation

Water Treatment

Advanced wastewater treatment and recycling systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for semiconductor waste management

ISO 14001

Environmental management system certified production

Carbon Footprint

Optimized transportation and packaging solutions

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art semiconductor chemical manufacturing facility employs advanced purification technology and continuous monitoring systems to ensure consistent SC2 Standard Clean quality and performance across all production batches.

Production Process

Advanced purification and blending in controlled clean-room environment

Multi-stage purification for electronic grade quality
Quality Testing

Comprehensive testing protocol including metals, particles, and organic impurities

ICP-MS verification and particle counting analysis
Quality Systems

ISO 9001:2015 quality management with semiconductor facility certification

Continuous improvement and process validation
Packaging Control

Ultra-clean packaging with inert atmosphere protection

Contamination prevention and stability assurance

Market Applications & Performance Data

Comprehensive semiconductor manufacturing data demonstrating SC2 Standard Clean effectiveness across diverse applications with quantified performance metrics and process validations.

Semiconductor Fabs
Oxide Removal: >99% efficiency Metal Contamination: <0.5 ppb total Process Yield: 99.9% device quality
Research Facilities
Surface Quality: Hydrogen terminated Reproducibility: >99% batch consistency Innovation: Advanced device support
Manufacturing Lines
Reliability: 99.9% process consistency Throughput: 25% faster etching cycles Cost Efficiency: Reduced chemical consumption

DRAVYOM Competitive Advantages

Superior Purity

Consistently exceeds electronic grade specifications with ultra-low impurities and exceptional semiconductor performance

Reliable Supply

Guaranteed availability with strategic inventory management and semiconductor-grade production scheduling

Semiconductor Expertise

Dedicated process engineering team provides method development and manufacturing support

Quality Assurance

Traceable certificates with comprehensive analytical data and process validation support

Global Standards

International compliance with SEMI, ASTM, and electronic grade specifications

Partnership Approach

Collaborative relationships with semiconductor facilities and custom process development