Epoxy Molding Compounds
Electronics High-Performance
Electronics Chemical

Epoxy Molding Compounds

Premium electronics grade Epoxy Molding Compounds manufactured to meet stringent semiconductor packaging specifications for IC encapsulation and component protection. Provides exceptional performance with superior reliability and consistent quality for advanced electronic packaging applications.

  • Electronics Grade Performance
  • Superior IC Encapsulation
  • Excellent Thermal Properties
  • Low Moisture Absorption
  • High Reliability Performance
  • Advanced Packaging Applications
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Technical Specifications

Compound Type: Thermoset epoxy resin
Filler Content: 70-85% by weight
Primary Filler: Fused silica (SiO₂)
Particle Size (D50): 5-20 μm
Molding Temperature: 165-185°C
Cure Time: 60-180 seconds
Spiral Flow (25mm): 80-150 cm
Flexural Strength: 120-180 MPa
Glass Transition Temp (Tg): 150-180°C
CTE (α1): 8-15 ppm/°C
CTE (α2): 35-60 ppm/°C
Thermal Conductivity: 0.7-1.2 W/m·K
Water Absorption: ≤ 0.15% (24h, 85°C)
Ionic Impurities: ≤ 10 ppm
Shelf Life: 6 months at 23°C
Storage Temperature: 5-25°C
Packaging Options: 25kg bags, 500kg pallets

Applications

IC Encapsulation
Semiconductor Packaging
Transfer Molding
BGA Packaging
QFN/QFP Packages
Power Modules
Quality Control
Research Applications
Automotive Electronics
Academic Research
Process Development
Material Testing

Industry-Specific Grades

DRAVYOM offers specialized epoxy molding compounds tailored for specific semiconductor packaging requirements, ensuring optimal flow properties, mechanical strength, and thermal performance for diverse electronic applications.

High-Flow Grade
Spiral Flow: 150 cm Fast Cure: 60 seconds Complex Geometries Application: Fine-pitch packages
Low-Stress Grade
Low CTE: 8 ppm/°C High Tg: 180°C Stress Relief Application: Large packages
Research Grade
Custom Formulations Small Quantities: Available Novel Additives Application: R&D applications
Automotive Grade
High Reliability Temperature Cycling AEC-Q100 Qualified Application: Automotive IC

Quality Standards

DRAVYOM's Epoxy Molding Compounds are manufactured under stringent quality control protocols, meeting international semiconductor industry standards including JEDEC, IPC, and ISO specifications. Our formulations ensure consistent molding performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
JEDEC Standards Compliance
High-Purity Epoxy Resins
Advanced Rheological Testing
Low Ionic Contamination
Batch-to-Batch Consistency
Complete Certificate of Analysis
Temperature-Controlled Storage & Delivery

Advanced Chemical Properties & Performance

Electronic Grade Epoxy Molding Compounds exhibit exceptional chemical properties essential for precision semiconductor packaging applications. The ultra-pure composition and optimized cure kinetics ensure reliable performance in demanding electronic manufacturing processes.

Molding Properties
Cure Temperature: 175-180°C
Cure Time: 90-120 seconds
Flow Length: 100-300 cm
Wire Sweep: < 2 mils (50µm)
Thermal Properties
Glass Transition (Tg): 150-175°C
Thermal Conductivity: 0.8-1.5 W/m·K
CTE (α1/α2): 8-12 / 25-35 ppm/°C
Deflection Temp: 160-180°C
Mechanical Properties
Flexural Strength: 120-180 MPa
Flexural Modulus: 15-25 GPa
Impact Strength: 15-25 kJ/m²
Hardness: 85-95 Shore D
Electrical Properties
Volume Resistivity: 10¹⁴-10¹⁶ Ω·cm
Dielectric Constant: 3.5-4.2 @1MHz
Dissipation Factor: 0.012-0.025
Dielectric Strength: 15-25 kV/mm
Processing Properties
Shelf Life: 6 months @-40°C
Preform Time: 8 hours @25°C
Mold Temperature: 175-180°C
Transfer Pressure: 5-15 MPa

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Epoxy Molding Compound superiority in semiconductor packaging with exceptional flow properties, thermal stability, and electrical insulation.

Flow Properties

100-300 cm flow length

Excellent moldability
Thermal Stability

Tg: 150-175°C

High temperature rated
Electrical Insulation

10¹⁴-10¹⁶ Ω·cm resistivity

Superior isolation
Fast Cure

90-120 second cycle

High throughput
Wire Protection

< 2 mils wire sweep

Minimal wire movement
Low Stress

8-12 ppm/°C CTE match

Reduced package stress

Safety Information

Contains epoxy resins and hardeners that may cause skin sensitization and respiratory irritation. Generates heat during cure. Handle with appropriate protective equipment including chemical-resistant gloves, safety goggles, and ensure adequate ventilation during processing.

Sensitizer
Exothermic
Respiratory Irritant

Storage & Handling

Store in original containers in freezer storage (-40°C) to maintain shelf life and prevent premature cure. Allow material to reach ambient temperature before use. Use appropriate molding equipment and maintain proper transfer molding conditions.

Freezer storage (-40°C)
Ambient temp before use
Transfer molding equipment
Time-temperature control

Chemical Mechanisms & Reaction Pathways

Epoxy molding compounds utilize controlled thermosetting chemistry and crosslinking mechanisms to provide reliable encapsulation and protection for semiconductor devices with predictable cure profiles and mechanical properties.

Cure Chemistry

Epoxy-hardener crosslinking through amine addition mechanisms

Controlled cure for optimal properties
Crosslinking Network

Three-dimensional polymer network formation

Enhanced mechanical and thermal properties
Adhesion Mechanisms

Chemical bonding to leadframes and packaging materials

Strong adhesion for device reliability
Thermal Properties

Glass transition control and thermal expansion management

Optimized for device protection

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor packaging facility access with complete documentation packages supporting international electronics manufacturing standards and assembly process qualifications.

JEDEC Standards

Joint Electron Device Engineering Council packaging specifications

IPC Specifications

Institute for Printed Circuits assembly and packaging standards

ASTM Standards

American Society for Testing and Materials molding compound testing

RoHS Compliance

Restriction of Hazardous Substances directive compliance

Process Validation

Supported packaging process qualification documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor packaging team provides comprehensive molding support, process optimization assistance, and analytical services to maximize EMC performance in your specific packaging applications.

Process Development
  • Molding process optimization support
  • Cure profile development guidance
  • Flow behavior optimization and validation
  • Custom formulation development
Analytical Services
  • Rheological testing and analysis
  • Thermal property measurement
  • Mechanical testing and validation
  • Packaging process qualification support
Technical Support
  • Molding troubleshooting consultation
  • Equipment compatibility guidance
  • Safety training and protocols
  • Semiconductor packaging best practices
Supply Solutions
  • Cold chain delivery systems
  • Emergency compound supply arrangements
  • Custom packaging and handling
  • Global packaging material network

Environmental Impact & Sustainability

Our EMC production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor packaging operations.

Waste Minimization

Optimized formulations with minimal waste generation

Solvent Recovery

Advanced solvent recovery and recycling systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for EMC waste management

ISO 14001

Environmental management system certified production

Container Recycling

Molding compound container return and recycling programs

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art EMC manufacturing facility employs advanced mixing technology and continuous monitoring systems to ensure consistent epoxy molding compound quality and performance across all production batches.

Production Process

Advanced mixing and compounding in controlled atmosphere environment

Multi-stage processing for uniform properties
Quality Testing

18-point analytical testing protocol including rheology and thermal properties

Flow analysis and performance validation
Quality Systems

ISO 9001:2015 quality management with electronics packaging accreditation

Continuous improvement and process validation
Packaging Control

Cold storage packaging with moisture protection

Shelf life preservation and stability assurance

Market Applications & Performance Data

Comprehensive semiconductor packaging data demonstrating EMC effectiveness across diverse applications with quantified performance metrics and assembly validations.

IC Packaging
Flow Length: >300mm at 175°C Adhesion: >5 MPa to copper CTE: 8-12 ppm/°C (below Tg)
Power Modules
Operating Temp: -55°C to +175°C Thermal Conductivity: 1.5 W/mK Wire Sweep: <2µm at 1000 psi
Automotive Electronics
Reliability: 1000+ thermal cycles Cure Time: 90 seconds at 175°C Yield: 99.8%+ molding success

DRAVYOM Competitive Advantages

Superior Performance

Consistently exceeds packaging specifications with optimized formulations and exceptional molding performance

Reliable Supply

Guaranteed availability with cold chain logistics and packaging material production scheduling

Packaging Expertise

Dedicated packaging process team provides formulation development and troubleshooting support

Quality Assurance

Traceable certificates with comprehensive analytical data and packaging validation support

Global Standards

International compliance with JEDEC, IPC, and ASTM specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with packaging manufacturers and custom compound development services