Dilute Hydrofluoric Acid
Electronics Ultra-Pure
Electronics Chemical

Dilute Hydrofluoric Acid (DHF)

Premium electronics grade DHF manufactured to meet stringent semiconductor industry specifications for etching and oxide removal. Provides exceptional precision and consistency with ultra-high purity for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Precision Oxide Etching
  • Silicon Dioxide Removal
  • Controlled Concentration
  • Consistent Etch Performance
  • Advanced Semiconductor Processing
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Technical Specifications

Chemical Name: Hydrofluoric Acid (Dilute)
Chemical Formula: HF
CAS Number: 7664-39-3
Concentration: 0.5-10% by weight
Standard Concentrations: 1%, 2%, 5%, 10%
Physical State: Clear aqueous solution
pH Value: 1.0-3.0
Density (20°C): 1.00-1.05 g/cm³
Etch Rate (SiO₂): 50-500 Å/min (depending on concentration)
Selectivity (SiO₂:Si₃N₄): 100:1-500:1
Selectivity (SiO₂:Si): 1000:1-5000:1
Metal Impurities: ≤ 0.1 ppm each
Chloride (Cl⁻): ≤ 1 ppm
Sulfate (SO₄²⁻): ≤ 1 ppm
Particle Count: ≤ 50 per mL (≥0.3μm)
Working Temperature: 20-40°C
Shelf Life: 12 months at room temperature
Packaging Options: 1L, 4L, 20L HDPE containers

Applications

Oxide Etching
Semiconductor Processing
Glass Etching
Silicon Dioxide Removal
Wafer Cleaning
Surface Preparation
Quality Control
Research Applications
Selective Etching
Academic Research
Process Development
Material Analysis

Industry-Specific Grades

DRAVYOM offers specialized dilute hydrofluoric acid solutions tailored for specific semiconductor and glass processing requirements, ensuring optimal etch rates, selectivity, and safety for diverse oxide removal applications.

Semiconductor Grade
Ultra-High Purity: >99.9% Low Metal Content: ≤0.1 ppm Particle Control Application: IC processing
Precision Etch
Concentration: 1-2% Controlled Etch Rate High Selectivity: >1000:1 Application: Precision etching
Research Grade
Custom Concentrations Small Volumes: Available Buffered Options Application: R&D applications
Standard Grade
Concentration: 5-10% General Applications Cost Optimized Application: General etching

Quality Standards

DRAVYOM's Dilute Hydrofluoric Acid is manufactured under stringent quality control protocols, meeting international semiconductor industry standards including SEMI, JEIDA, and ISO specifications. Our formulations ensure consistent etching performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI Standards Compliance
Electronic Grade Purity
Advanced Chemical Analysis
Ultra-Low Metal Contamination
Batch-to-Batch Consistency
Complete Certificate of Analysis
Safe Handling & Delivery

Advanced Chemical Properties & Performance

Electronic Grade Dilute Hydrofluoric Acid exhibits exceptional chemical properties essential for precision semiconductor etching applications. The ultra-pure composition and controlled concentration ensure reliable performance in demanding electronic manufacturing processes.

Etching Properties
SiO₂ Etch Rate: 100-1000 Å/min
Selectivity: SiO₂:Si > 1000:1
Uniformity: ±3% across wafer
Surface Finish: < 0.5 nm RMS
Physical Properties
HF Concentration: 0.5-10% w/w
pH Value: 1.0-3.0 (acidic)
Density: 1.002-1.05 g/cm³
Surface Tension: 65-70 mN/m
Process Performance
Temperature Range: 20-40°C operation
Bath Life: 4-24 hours active
Agitation: Gentle stirring required
Reproducibility: ±5% etch rate
Purity Specifications
Metal Impurities: ≤ 10 ppb total
Particle Count: ≤ 50 (>0.5µm)/mL
Organic Impurities: ≤ 10 ppb TOC
Residual Fluoride: Controlled levels
Stability Properties
Shelf Life: 6 months (unopened)
Storage Temperature: 15-25°C
Chemical Stability: Stable in plastic
Activity Loss: < 2% per month

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Dilute Hydrofluoric Acid superiority in semiconductor applications with exceptional etching precision, selectivity control, and process reliability.

High Selectivity

SiO₂:Si selectivity > 1000:1

Precise oxide removal
Etch Rate Control

100-1000 Å/min (tunable)

Flexible process control
Surface Quality

< 0.5 nm RMS roughness

Smooth etch finish
Uniformity

±3% across 300mm wafer

Excellent consistency
Reproducibility

±5% batch-to-batch

Reliable performance
Process Window

20-40°C operation

Flexible conditions

Safety Information

Extremely hazardous acid that can cause severe burns and bone damage. Hydrofluoric acid penetrates skin and attacks calcium in bones. Handle with extreme caution using appropriate protective equipment including HF-specific gloves, safety goggles, and protective clothing. Ensure calcium gluconate gel availability.

Toxic
Corrosive
Bone Hazard

Storage & Handling

Store in original fluoropolymer or polyethylene containers in a cool, well-ventilated area with HF-specific safety equipment. Keep containers tightly sealed and use only HF-compatible materials. Maintain calcium gluconate gel and emergency procedures readily available.

Cool storage (15-25°C)
HF-compatible containers
Excellent ventilation
Calcium gluconate ready

Chemical Mechanisms & Reaction Pathways

Dilute hydrofluoric acid exhibits controlled fluoride etching chemistry through selective silicon dioxide dissolution and glass material removal with predictable etch rates and exceptional selectivity for semiconductor processing.

Etching Mechanism

SiO₂ + 6HF → H₂SiF₆ + 2H₂O (controlled oxide removal)

Precise etching for device fabrication
Glass Dissolution

Selective fluoride attack on silicon-oxygen bonds

High selectivity over silicon and metals
Surface Chemistry

Controlled surface reactions for clean etching

Optimized for minimal surface damage
Mass Transport

Diffusion-controlled HF delivery and product removal

Uniform etching across wafer surfaces

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor facility access with complete documentation packages supporting international electronics manufacturing standards and etching process qualifications.

SEMI Standards

Semiconductor Equipment and Materials International compliance

Etching Specifications

Wet etching process and equipment safety standards

HF Handling Standards

Hydrofluoric acid handling and safety protocol specifications

Transport Regulations

Hazardous material transport and shipping compliance

Process Validation

Supported etching process qualification documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor process team provides comprehensive etching support, process optimization assistance, and analytical services to maximize DHF performance in your specific semiconductor manufacturing applications.

Process Development
  • Etching process optimization support
  • Etch rate control guidance
  • Selectivity optimization and validation
  • Custom concentration development
Analytical Services
  • Etch rate analysis and monitoring
  • Surface quality assessment
  • Contamination analysis and testing
  • Etching process qualification support
Technical Support
  • HF safety training and consultation
  • Equipment compatibility guidance
  • Emergency response protocols
  • Semiconductor etching best practices
Supply Solutions
  • Safe delivery and handling systems
  • Emergency HF supply arrangements
  • Custom concentration preparation
  • Global specialty chemical network

Environmental Impact & Sustainability

Our DHF production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor etching operations.

Waste Minimization

Optimized formulations with minimal waste generation

HF Neutralization

Advanced neutralization and fluoride recovery systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for HF waste management

ISO 14001

Environmental management system certified production

Container Recycling

HF-resistant container return and recycling programs

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art HF manufacturing facility employs advanced dilution technology and continuous monitoring systems to ensure consistent DHF quality and performance across all production batches.

Production Process

Advanced dilution and mixing in controlled HF-safe environment

Precise concentration control for etching applications
Quality Testing

15-point analytical testing protocol including concentration and impurities

Ion chromatography verification and performance validation
Quality Systems

ISO 9001:2015 quality management with HF handling accreditation

Continuous improvement and safety validation
Packaging Control

HF-resistant containers with specialized safety packaging

Safe transport and contamination prevention

Market Applications & Performance Data

Comprehensive semiconductor fabrication data demonstrating DHF effectiveness across diverse etching applications with quantified performance metrics and process validations.

Semiconductor Fabs
Etch Rate: 100-1000 Å/min Selectivity: >1000:1 SiO₂/Si Uniformity: ±3% across wafer
MEMS Processing
Sidewall Quality: <2nm roughness Aspect Ratio: >50:1 capability Pattern Fidelity: ±5% CD control
Solar Manufacturing
Surface Texturing: 20% light trapping Throughput: 50% faster processing Yield: 99%+ process success

DRAVYOM Competitive Advantages

Superior Safety

Consistently exceeds safety specifications with specialized HF handling and exceptional process safety

Reliable Supply

Guaranteed availability with specialized logistics and HF production scheduling

HF Expertise

Dedicated HF safety team provides handling guidance and emergency support

Quality Assurance

Traceable certificates with comprehensive analytical data and safety validation support

Global Standards

International compliance with SEMI and HF handling specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with semiconductor manufacturers and custom HF solutions