Die Attach Adhesives
Electronics High-Performance
Electronics Chemical

Die Attach Adhesives

Premium electronics grade Die Attach Adhesives manufactured to meet stringent semiconductor industry specifications for assembly applications. Provides exceptional performance with excellent thermal and electrical properties for advanced die bonding processes.

  • Electronics Grade Quality
  • Superior Die Bonding
  • Excellent Thermal Conductivity
  • Outstanding Adhesion Strength
  • Reliable Electrical Properties
  • Advanced Assembly Applications
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Technical Specifications

Adhesive Type: Silver-filled epoxy
Silver Content: 75-85% by weight
Particle Size (Ag): 1-3 μm
Viscosity (25°C): 50,000-200,000 cP
Cure Temperature: 150-200°C
Cure Time: 1-4 hours
Thermal Conductivity: 2-5 W/m·K
Electrical Resistivity: ≤ 0.01 Ω·cm
Glass Transition Temp (Tg): 120-180°C
CTE (α1): 15-25 ppm/°C
Die Shear Strength: ≥ 5 kg
Bond Line Thickness: 5-25 μm
Void Content: ≤ 5%
Working Life (25°C): 4-8 hours
Storage Temperature: -20°C to +5°C
Shelf Life: 6 months (frozen)
Packaging Options: 10g, 30g, 100g syringes

Applications

Die Bonding
Semiconductor Assembly
Package Assembly
Thermal Management
High-Power Devices
LED Assembly
Quality Control
Research Applications
Power Electronics
Academic Research
Process Development
Material Testing

Industry-Specific Grades

DRAVYOM offers specialized die attach adhesive formulations tailored for specific semiconductor packaging requirements, ensuring optimal thermal and electrical performance, reliability, and processing compatibility for diverse assembly applications.

High Conductivity
Silver Content: 85% Thermal Cond.: 5 W/m·K Low Resistivity: ≤0.005 Ω·cm Application: Power devices
Fast Cure
Cure Time: 1 hour Cure Temp: 150°C High Throughput Application: High-volume assembly
Research Grade
Custom Formulations Small Volumes: Available Novel Fillers Application: R&D applications
Standard Grade
Silver Content: 75% Balanced Properties Cost Optimized Application: General assembly

Quality Standards

DRAVYOM's Die Attach Adhesives are manufactured under stringent quality control protocols, meeting international semiconductor industry standards including JEDEC, IPC, and ISO specifications. Our formulations ensure consistent bonding performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
JEDEC Standards Compliance
High-Purity Silver Fillers
Advanced Thermal Analysis
Void-Free Bonding
Batch-to-Batch Consistency
Complete Certificate of Analysis
Cold Chain Storage & Delivery

Advanced Chemical Properties & Performance

Electronic Grade Die Attach Adhesives exhibit exceptional chemical properties essential for precision semiconductor assembly applications. The ultra-pure composition and optimized thermal properties ensure reliable performance in demanding electronic manufacturing processes.

Bonding Properties
Bond Strength: 20-50 MPa (shear)
Cure Temperature: 150-200°C
Cure Time: 30-120 minutes
Bond Line Thickness: 5-25 µm
Thermal Properties
Thermal Conductivity: 20-150 W/m·K
Glass Transition (Tg): 125-200°C
CTE: 15-35 ppm/°C
Operating Temperature: -55 to +175°C
Electrical Properties
Electrical Resistivity: 10⁻⁵ to 10⁻³ Ω·cm
Thermal Resistance: 0.1-1.0 °C·cm²/W
Silver Content: 70-90% by weight
Dielectric Strength: Low resistance path
Physical Properties
Viscosity (25°C): 50,000-200,000 cPs
Density: 3.0-4.5 g/cm³
Pot Life (25°C): 8-24 hours
Particle Size: < 5 µm (D90)
Reliability Properties
Shelf Life: 6-12 months (frozen)
Storage Temperature: -40°C freezer
Moisture Sensitivity: Level 1 (MSL1)
Void Content: < 2% typical

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Die Attach Adhesives superiority in semiconductor assembly with exceptional thermal management, bond reliability, and electrical performance.

Thermal Management

20-150 W/m·K conductivity

Excellent heat dissipation
Bond Strength

20-50 MPa shear strength

Superior mechanical bond
Electrical Performance

10⁻⁵ to 10⁻³ Ω·cm resistivity

Low electrical resistance
Temperature Range

-55 to +175°C operation

Wide operating window
Void Control

< 2% void content

Superior bond integrity
Process Speed

30-120 minute cure

Flexible cure schedules

Safety Information

Contains organic solvents and silver particles that may cause skin and eye irritation. Handle with appropriate protective equipment including chemical-resistant gloves, safety goggles, and protective clothing. Ensure adequate ventilation during dispensing and curing operations.

Irritant
Solvent Vapors
Eye Irritant

Storage & Handling

Store in original containers in freezer storage (-40°C) to maintain shelf life. Allow material to reach room temperature before use. Use appropriate mixing and dispensing equipment to maintain material properties and prevent contamination.

Freezer storage (-40°C)
Room temp before use
Original containers only
Proper mixing equipment

Chemical Mechanisms & Reaction Pathways

Die attach adhesives utilize advanced polymer chemistry and silver conduction mechanisms to provide reliable thermal and electrical connections in semiconductor assembly with predictable cure kinetics and bond formation.

Cure Mechanisms

Thermal cure and UV initiation for controlled polymerization

Precise curing for optimal bond strength
Adhesion Chemistry

Surface interaction and chemical bonding mechanisms

Strong adhesion to diverse substrates
Conduction Pathways

Silver particle networking for electrical conductivity

Optimized for low resistance connections
Thermal Transfer

Heat dissipation through polymer matrix and fillers

Efficient thermal management for devices

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor assembly facility access with complete documentation packages supporting international electronics manufacturing standards and assembly process qualifications.

JEDEC Standards

Joint Electron Device Engineering Council assembly specifications

IPC Specifications

Institute for Printed Circuits electronic assembly standards

ASTM Standards

American Society for Testing and Materials adhesive testing

RoHS Compliance

Restriction of Hazardous Substances directive compliance

Process Validation

Supported assembly process qualification documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor assembly team provides comprehensive bonding support, process optimization assistance, and analytical services to maximize die attach adhesive performance in your specific assembly applications.

Process Development
  • Bonding process optimization support
  • Cure profile development guidance
  • Bond strength optimization and validation
  • Custom adhesive formulation development
Analytical Services
  • Bond strength testing and analysis
  • Thermal conductivity measurement
  • Reliability testing and validation
  • Assembly process qualification support
Technical Support
  • Assembly troubleshooting consultation
  • Equipment compatibility guidance
  • Safety training and protocols
  • Semiconductor assembly best practices
Supply Solutions
  • Cold chain delivery systems
  • Emergency adhesive supply arrangements
  • Custom packaging and dispensing
  • Global assembly material network

Environmental Impact & Sustainability

Our die attach adhesive production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor assembly operations.

Waste Minimization

Optimized formulations with minimal waste generation

Solvent Recovery

Advanced solvent recovery and recycling systems

Clean Production

Energy-efficient manufacturing with emission controls

Safe Disposal

Comprehensive guidance for adhesive waste management

ISO 14001

Environmental management system certified production

Container Recycling

Syringe and cartridge return and recycling programs

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art adhesive manufacturing facility employs advanced mixing technology and continuous monitoring systems to ensure consistent die attach adhesive quality and performance across all production batches.

Production Process

Advanced mixing and dispersion in controlled environment

Multi-stage processing for uniform properties
Quality Testing

15-point analytical testing protocol including viscosity and cure properties

Rheological analysis and performance validation
Quality Systems

ISO 9001:2015 quality management with electronics assembly accreditation

Continuous improvement and process validation
Packaging Control

Cold storage packaging with moisture protection

Shelf life preservation and stability assurance

Market Applications & Performance Data

Comprehensive semiconductor assembly data demonstrating die attach adhesive effectiveness across diverse applications with quantified performance metrics and assembly validations.

Semiconductor Assembly
Bond Strength: >50 MPa shear strength Thermal Conductivity: 3-25 W/mK Reliability: 1000+ thermal cycles
Power Electronics
Current Density: >100 A/cm² Operating Temp: -55°C to +200°C Void Fraction: <2% after cure
LED Manufacturing
Light Output: 98%+ transmission Cure Time: 15 second UV cure Yield: 99.5%+ assembly success

DRAVYOM Competitive Advantages

Superior Performance

Consistently exceeds assembly specifications with optimized formulations and exceptional bonding performance

Reliable Supply

Guaranteed availability with cold chain logistics and assembly material production scheduling

Assembly Expertise

Dedicated assembly process team provides formulation development and troubleshooting support

Quality Assurance

Traceable certificates with comprehensive analytical data and assembly validation support

Global Standards

International compliance with JEDEC, IPC, and ASTM specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with assembly manufacturers and custom adhesive development services