Copper CMP Slurries
Electronics Ultra-Pure
Electronics Chemical

Copper CMP Slurries

Premium electronics grade Copper CMP slurries manufactured to meet stringent semiconductor industry specifications for interconnect processing and damascene planarization. Provides exceptional copper polishing performance with ultra-high purity and consistent formulation for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Copper Damascene Optimized
  • Superior Selectivity Control
  • Low Contamination Levels
  • Consistent Removal Rates
  • Advanced Interconnect Processing
Request Quote Technical Support

Technical Specifications

Primary Abrasive: Alumina (Al₂O₃)
Particle Size: 30-120 nm
Solid Content: 8-25% by weight
pH Value: 3.0-10.5
Viscosity (20°C): ≤ 50 cP
Density (20°C): 1.05-1.20 g/cm³
Cu Removal Rate: 2000-8000 Å/min
Selectivity (Cu:Ta): 5:1-30:1
Selectivity (Cu:TaN): 3:1-20:1
Selectivity (Cu:SiO₂): 10:1-100:1
Corrosion Inhibitor: BTA or derivative
Oxidizer: H₂O₂ (optional)
Surface Roughness: ≤ 2 Å RMS
Defectivity: ≤ 0.05 defects/cm²
Metal Impurities: ≤ 0.1 ppm each
Large Particle Count: ≤ 20 per mL (≥0.5μm)
Packaging Options: 1L, 20L, 200L containers

Applications

Copper CMP
Interconnect Formation
Damascene Process
Metal Planarization
Dual Damascene
Barrier Polishing
Quality Control
Research Applications
Via Formation
Academic Research
Process Development
Material Testing

Industry-Specific Grades

DRAVYOM offers specialized copper CMP slurry formulations tailored for specific interconnect manufacturing requirements, ensuring optimal removal rates, selectivity, and surface quality for diverse semiconductor technology nodes.

High Rate Cu CMP
Removal Rate: 6000+ Å/min Particle Size: 80 nm High Throughput Application: Bulk Cu removal
Selective Cu CMP
High Selectivity: 30:1 Low Defectivity Excellent Uniformity Application: Barrier stop
Research Grade
Custom Formulations Small Volumes: Available Novel Chemistry Application: R&D applications
Production Grade
Large Volume: Available Consistent Performance Cost Optimized Application: Manufacturing

Quality Standards

DRAVYOM's Copper CMP Slurries are manufactured under stringent quality control protocols, meeting international semiconductor industry standards including SEMI, ITRS, and ISO specifications. Our formulations ensure consistent polishing performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI CMP Standards Compliance
Controlled Abrasive Distribution
Advanced Process Analytics
Ultra-Low Defectivity
Batch-to-Batch Consistency
Complete Certificate of Analysis
Temperature-Controlled Delivery

Advanced Chemical Properties & Performance

Electronic Grade Copper CMP Slurries exhibit exceptional chemical properties essential for advanced semiconductor applications. The ultra-pure composition and optimized abrasive particles ensure reliable performance in demanding electronic manufacturing processes.

CMP Properties
Cu Removal Rate: 1000-4000 Å/min
Ta/TaN Selectivity: 20:1 to 100:1
Surface Finish: < 0.5 nm RMS
Dishing/Erosion: < 50 Å (narrow lines)
Physical Properties
pH Value: 3.0-5.0 (acidic)
Viscosity (25°C): 3.0-8.0 cP
Density: 1.20-1.35 g/cm³
Solids Content: 3-15% w/w
Process Performance
Uniformity: ±3% across wafer
Defect Density: < 10 defects/cm²
Process Stability: 4-12 hour operation
Temperature Range: 20-40°C operation
Purity Specifications
Total Metallic Impurities: ≤ 0.1 ppm
Large Particle Count: ≤ 100 (>0.5µm)/mL
Copper Content: ≤ 0.01 ppm
Chloride Content: ≤ 0.1 ppm
Stability Properties
Shelf Life: 6 months (unopened)
Storage Temperature: 15-25°C
Particle Stability: No agglomeration
pH Drift: ±0.2 units/month

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Copper CMP Slurries superiority in advanced semiconductor applications with exceptional planarization efficiency, selectivity control, and defect minimization.

High Selectivity

Cu:Ta selectivity up to 100:1

Superior barrier preservation
Defect Control

Micro-scratches: < 10 defects/cm²

Excellent surface quality
Removal Rate

Cu: 1000-4000 Å/min (tunable)

High throughput capability
Topography

Dishing/erosion: < 50 Å

Superior planarity control
Batch Consistency

Variation: ±2% between lots

Exceptional reproducibility
Process Stability

4-12 hours continuous operation

Extended process windows

Safety Information

Acidic slurry that may cause eye and skin irritation. Contains oxidizing agents and chemical additives requiring appropriate handling. Use protective equipment including safety goggles, chemical-resistant gloves, and protective clothing. Ensure adequate ventilation and emergency procedures are in place.

Corrosive
Eye Irritant
Oxidizing

Storage & Handling

Store in original containers in a cool, dry area with continuous gentle agitation capability. Keep containers tightly sealed and protect from freezing. Use appropriate acid-compatible equipment to maintain particle suspension and prevent settling.

Cool storage (15-25°C)
Continuous gentle agitation
Protect from freezing
Acid-compatible materials

Chemical Mechanisms & Reaction Pathways

Electronic Grade Copper CMP Slurries exhibit controlled chemical-mechanical polishing mechanisms through optimized oxidation and dissolution pathways, enabling precise semiconductor processing applications with predictable copper removal rates and surface uniformity.

Oxidation-Dissolution

Controlled copper oxidation followed by chemical dissolution

Precise copper planarization for interconnects
Mechanical Polishing

Controlled abrasive action through optimized particle systems

Essential for copper damascene processes
Surface Passivation

Controlled surface protection during CMP processing

Prevents copper corrosion and dishing
Barrier Selectivity

Optimized selectivity between copper and barrier materials

Critical for advanced interconnect fabrication

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor manufacturing access with complete documentation packages supporting international standards and electronic-grade specifications.

SEMI Standards

Semiconductor Equipment and Materials International specifications compliance

ISO 9001:2015

International quality management system certification

Electronic Grade

Ultra-pure specifications for semiconductor manufacturing

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported semiconductor process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor chemistry team provides comprehensive process support, troubleshooting assistance, and engineering services to optimize Electronic Grade Copper CMP Slurries performance in your specific manufacturing applications.

Process Development
  • Semiconductor process optimization support
  • CMP procedure guidance
  • Process reliability validation
  • Custom slurry formulation procedures
Analytical Services
  • Certificate of Analysis verification
  • Custom particle analysis
  • Trace contamination testing
  • Process validation support
Technical Support
  • Process troubleshooting consultation
  • Storage and handling guidance
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Consistent batch scheduling
  • Emergency supply arrangements
  • Custom formulation options
  • Global distribution network

Environmental Impact & Sustainability

Our Electronic Grade Copper CMP Slurries production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor operations.

Waste Minimization

Optimized production with minimal waste generation

Water Treatment

Advanced wastewater treatment and recycling systems

Clean Production

Energy-efficient synthesis with emission controls

Safe Disposal

Comprehensive guidance for manufacturing waste management

ISO 14001

Environmental management system certified production

Container Recycling

Chemical container return and recycling programs

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art semiconductor chemical manufacturing facility employs advanced purification technology and continuous monitoring systems to ensure consistent Electronic Grade Copper CMP Slurries quality and performance across all production batches.

Production Process

Advanced slurry formulation and particle processing

Precision CMP slurry for copper planarization
Quality Testing

Comprehensive analytical testing including particle size and contamination

Advanced particle characterization and validation
Quality Systems

ISO 9001:2015 quality management with semiconductor facility certification

Continuous improvement and process validation
Packaging Control

Specialized containers with agitation systems

Particle suspension and contamination prevention

Market Applications & Performance Data

Comprehensive semiconductor manufacturing data demonstrating Electronic Grade Copper CMP Slurries effectiveness across diverse applications with quantified performance metrics and process validations.

Copper CMP
Precision: ±0.02% removal rate control Purity: >99.99% slurry grade Yield: 99.95%+ process success
Interconnect Processing
Efficiency: 99.9%+ surface uniformity Selectivity: High copper-to-barrier selectivity Reliability: 100% batch consistency
Damascene Processing
Performance: Zero defect contribution Validation: 100% process qualification Efficiency: 40% faster processing

DRAVYOM Competitive Advantages

Superior Purity

Consistently exceeds semiconductor specifications with ultra-low impurities and exceptional electronic performance

Reliable Supply

Guaranteed availability with strategic inventory management and electronic-grade production scheduling

Process Expertise

Dedicated semiconductor chemistry team provides process development and optimization support

Quality Assurance

Traceable certificates with comprehensive analytical data and process validation support

Global Standards

International compliance with SEMI, ISO, and electronics specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with semiconductor manufacturers and custom grade development services