Aluminum Oxide Slurries
Electronics Ultra-Pure
Electronics Chemical

Aluminum Oxide (Al2O3) Slurries

Premium electronics grade Aluminum Oxide slurries manufactured to meet stringent semiconductor industry specifications for CMP polishing and precision surface finishing. Provides exceptional polishing performance with ultra-high purity and consistent particle distribution for advanced semiconductor manufacturing processes.

  • Electronics Grade Purity
  • Precision CMP Polishing
  • Superior Surface Finish
  • Controlled Particle Size
  • Consistent Slurry Stability
  • Advanced Semiconductor Applications
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Technical Specifications

Primary Abrasive: Aluminum Oxide (Al₂O₃)
Particle Size: 50-500 nm (controlled distribution)
Solid Content: 5-20 wt%
pH Value: 8.5-10.5
Removal Rate: 100-2000 Å/min
Selectivity: Customizable ratios
Metal Impurities: ≤ 0.1 ppm each
Particle Count: ≤ 50 LPC (≥0.5μm)
Stability: 12 months minimum
Viscosity: 1-10 cP
Sodium (Na): ≤ 10 ppm
Potassium (K): ≤ 10 ppm
Iron (Fe): ≤ 1 ppm
Chloride (Cl): ≤ 50 ppm
Storage Temperature: 5-40°C
Shelf Life: 12-18 months
Packaging Options: 5L, 20L, 200L containers

Applications

CMP Processing
Wafer Planarization
Semiconductor Manufacturing
Surface Finishing
Metal Polishing
Oxide Removal
Quality Control
Research Applications
Surface Preparation
Academic Research
Process Development
Equipment Maintenance

Industry-Specific Grades

DRAVYOM offers specialized aluminum oxide slurry formulations tailored for specific CMP requirements, ensuring optimal planarization performance and regulatory compliance across diverse semiconductor applications.

Standard CMP
Particle Size: 100-300 nm Removal Rate: 500-1000 Å/min Solid Content: 10-15% Application: General CMP
Ultra-Fine Grade
Particle Size: 50-150 nm Removal Rate: 200-500 Å/min Surface Finish: <5 Å Ra Application: Final polishing
High-Selectivity
Selectivity: >100:1 Particle Size: 100-250 nm pH Controlled: 9.0-9.5 Application: Selective removal
Research Grade
Customizable: Yes Small Volumes: Available Special Additives: Optional Application: R&D work

Quality Standards

DRAVYOM's Electronic Grade Aluminum Oxide Slurries are manufactured under stringent quality control protocols, meeting international CMP industry standards including SEMI, ASTM, and ISO specifications. Our formulations ensure consistent polishing performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
SEMI CMP Standards Compliance
Controlled Particle Distribution
Advanced Particle Analysis
Ultra-Low Metal Contamination
Batch-to-Batch Consistency
Complete Certificate of Analysis
Temperature-Controlled Logistics

Advanced Chemical Properties & Performance

Electronic Grade Aluminum Oxide Slurries exhibit exceptional chemical properties essential for CMP applications. The ultra-pure composition and precise particle characteristics ensure reliable performance in demanding semiconductor manufacturing processes.

CMP Properties
Removal Rate: 50-500 Å/min (tunable)
Particle Size: 10-100 nm (controlled)
Surface Roughness: < 2 Å RMS
Uniformity: ±3% across wafer
Physical Properties
pH Value: 8.5-10.5
Viscosity (25°C): 1.5-3.0 cP
Density: 1.15-1.25 g/cm³
Solids Content: 5-20% w/w
Process Performance
Selectivity: High material selectivity
Defect Density: Minimal micro-scratching
Planarization: Excellent local/global
Process Window: Wide operational range
Purity Specifications
Total Metallic Impurities: ≤ 0.1 ppm
Large Particle Count: ≤ 100 (>0.5µm)/mL
Organic Content: Controlled additives only
Endotoxin Level: ≤ 0.1 EU/mL
Stability Properties
Shelf Life: 6 months (unopened)
Storage Temperature: 15-25°C
Particle Stability: No agglomeration
pH Drift: ±0.2 units/month

Performance Characteristics

Detailed performance metrics demonstrate Electronic Grade Aluminum Oxide Slurries superiority in CMP applications with exceptional planarization efficiency, defect control, and process repeatability.

Planarization Efficiency

Global: 95%+, Local: 98%+ planarization

Superior surface uniformity achievement
Defect Control

Micro-scratches: <10 defects/cm²

Exceptional surface quality
Removal Rate Control

Uniformity: ±3% across wafer

Precise material removal control
Process Stability

Temperature range: 15-40°C operation

Consistent across conditions
Batch Consistency

Variation: ±2% between lots

Exceptional reproducibility
Process Life

6-12 hours continuous operation

Extended operational window

Safety Information

Alkaline slurry that may cause eye and skin irritation. Handle with appropriate protective equipment including safety goggles, chemical-resistant gloves, and protective clothing. Ensure adequate ventilation and emergency procedures are in place.

Irritant
Eye Irritant
Skin Irritant

Storage & Handling

Store in original containers in a cool, dry area with continuous agitation capability. Keep containers tightly sealed and protect from freezing. Use appropriate mixing equipment to maintain particle suspension and prevent settling.

Cool storage (15-25°C)
Continuous gentle agitation
Protect from freezing
Original containers only

Chemical Mechanisms & Reaction Pathways

Electronic Grade Aluminum Oxide Slurries exhibit controlled mechanical and chemical planarization through abrasive particle interactions, enabling precise semiconductor processing applications with predictable polishing mechanisms and controlled material removal pathways.

Mechanical Polishing

Controlled abrasive action through alumina particle interactions

Precise material removal for planarization
Chemical Etching

Controlled chemical dissolution combined with mechanical action

Essential for CMP processing applications
Surface Passivation

Controlled surface layer formation during polishing

Enables selective material removal rates
Particle Suspension

Stable colloidal suspension for uniform polishing

Consistent planarization for device fabrication

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global semiconductor manufacturing access with complete documentation packages supporting international standards and electronic-grade specifications.

SEMI Standards

Semiconductor Equipment and Materials International specifications compliance

ISO 9001:2015

International quality management system certification

Electronic Grade

Ultra-pure specifications for semiconductor manufacturing

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported semiconductor process validation documentation

SDS Documentation

Multi-language Safety Data Sheets (16 sections, GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's semiconductor chemistry team provides comprehensive process support, troubleshooting assistance, and engineering services to optimize Electronic Grade Aluminum Oxide Slurries performance in your specific manufacturing applications.

Process Development
  • CMP process optimization support
  • Polishing procedure guidance
  • Process reliability validation
  • Custom slurry formulations
Analytical Services
  • Certificate of Analysis verification
  • Particle size analysis
  • Trace metal contamination testing
  • Process validation support
Technical Support
  • Process troubleshooting consultation
  • Storage and handling guidance
  • Safety training and protocols
  • Manufacturing best practices
Supply Solutions
  • Consistent batch scheduling
  • Emergency supply arrangements
  • Custom packaging options
  • Global distribution network

Environmental Impact & Sustainability

Our Electronic Grade Aluminum Oxide Slurries production emphasizes environmental responsibility through sustainable manufacturing practices, waste minimization, and comprehensive environmental impact management for semiconductor operations.

Waste Minimization

Optimized production with minimal waste generation

Water Treatment

Advanced wastewater treatment and recycling systems

Clean Production

Energy-efficient synthesis with emission controls

Safe Disposal

Comprehensive guidance for manufacturing waste management

ISO 14001

Environmental management system certified production

Container Recycling

Chemical container return and recycling programs

Manufacturing Excellence & Quality Control

DRAVYOM's state-of-the-art semiconductor chemical manufacturing facility employs advanced particle processing technology and continuous monitoring systems to ensure consistent Electronic Grade Aluminum Oxide Slurries quality and performance across all production batches.

Production Process

Advanced particle processing and formulation in controlled clean-room environment

Controlled particle size distribution for CMP applications
Quality Testing

Comprehensive particle analysis and purity testing protocols

Particle size analysis and contamination verification
Quality Systems

ISO 9001:2015 quality management with semiconductor facility certification

Continuous improvement and process validation
Packaging Control

Specialized containers with agitation systems for uniform distribution

Particle stability and contamination prevention

Market Applications & Performance Data

Comprehensive CMP processing data demonstrating Electronic Grade Aluminum Oxide Slurries effectiveness across diverse applications with quantified performance metrics and process validations.

CMP Processing
Uniformity: ±2% across wafer Removal Rate: 1000-5000 Å/min Yield: 99.5%+ process success
Planarization
Smoothness: <5 Å RMS roughness Selectivity: Controlled material removal Reliability: 100% batch consistency
Semiconductor Manufacturing
Performance: Zero defect contribution Validation: 100% process qualification Efficiency: 25% faster processing

DRAVYOM Competitive Advantages

Superior Uniformity

Consistently delivers exceptional particle size distribution and polishing performance across all batches

Reliable Supply

Guaranteed availability with strategic inventory management and CMP-grade production scheduling

CMP Expertise

Dedicated CMP chemistry team provides process development and optimization support

Quality Assurance

Traceable certificates with comprehensive particle analysis and process validation support

Global Standards

International compliance with SEMI, ISO, and CMP specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with semiconductor manufacturers and custom slurry development services