Electroless Gold Plating Solutions
Electroless Gold Grade
Electroplating Chemical

Electroless Gold Plating Solutions

Professional Electroless Gold Plating Solutions specifically formulated for high-quality gold deposition without electrical current. Our autocatalytic plating system delivers uniform gold coating and excellent adhesion for electronics, jewelry, and precision component applications requiring consistent performance.

  • Autocatalytic Process
  • No Electrical Current Required
  • Uniform Gold Deposition
  • Professional Grade Quality
  • Excellent Adhesion
  • Consistent Performance
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Technical Specifications

Product Type: Electroless gold plating solution
Gold Content: 4-8 g/L as Au
Gold Source: Potassium gold cyanide
Reducing Agent: Sodium hypophosphite
Complexing Agent: Sodium cyanide
pH Range: 12.5-13.5 (alkaline)
Operating Temperature: 85-95°C
Deposition Rate: 0.5-1.0 μm/hour
Deposit Thickness: 0.1-2.0 μm typical
Gold Purity: ≥ 99.5% Au in deposit
Phosphorus Content: 6-10% in deposit
Resistivity: 8-12 μΩ·cm
Hardness: 200-300 HV
Appearance: Matte to semi-bright gold
Solution Stability: 6-8 hours at operating temp
Package Sizes: 1L, 5L, 20L containers
Shelf Life: 12 months concentrate
Agitation: Mechanical or air required

Applications

Semiconductor Wire Bonding
Electronic Connectors
IC Package Substrates
RF/Microwave Components
Aerospace Electronics
Medical Devices
High-Frequency Circuits
Luxury Electronics
Data Center Equipment
Automotive Electronics
Corrosion Protection
Optical Reflectors

Industry-Specific Grades

DRAVYOM offers specialized electroless gold plating formulations tailored for specific electronic applications, ensuring optimal deposition quality, wire bondability, and solderability for diverse semiconductor and connector requirements.

Wire Bond Grade
Gold Content: 6-8 g/L Phosphorus: 6-8% Bondability: Excellent Application: IC packaging
Connector Grade
Gold Content: 4-6 g/L Phosphorus: 8-10% Hardness: 250-300 HV Application: Electronic connectors
Aerospace Grade
Gold Content: 6-8 g/L Purity: ≥ 99.9% Qualification: AS9100 Application: Critical systems
Medical Grade
Gold Content: 4-6 g/L Biocompatibility: USP Class VI Purity: Ultra-high Application: Medical devices

Quality Standards

DRAVYOM's electroless gold plating solutions are manufactured under stringent quality control protocols, meeting international electronics standards including IPC-4552, ASTM B488, and industry specifications for semiconductor and connector applications.

ISO 9001:2015 Certified Manufacturing
IPC-4552 Standards Compliance
≥ 99.5% Gold Purity
XRF Gold Content Analysis
Wire Bond Shear Testing
Thermal Cycling Qualification
Process Performance Certificate
Temperature-Controlled Shipping

Advanced Chemical Properties & Performance

Electroless Gold Plating exhibits exceptional chemical properties essential for precision electroplating applications. Its advanced formulation and stable gold complex ensure reliable performance in demanding electronic and jewelry applications.

Chemical Properties
Gold Content: 1-4 g/L Au as complex
pH Range: 12.5-13.5 (alkaline)
Reducing Agent: Formaldehyde/DMAB
Complex Stability: Stable for 6 months
Operating Conditions
Operating Temperature: 85-95°C
Deposition Rate: 0.1-0.3 μm/min
Bath Loading: 2-4 dm²/L
Agitation: Gentle air/mechanical
Plating Performance
Deposit Purity: 99.9% Au minimum
Hardness: 90-130 HV
Thickness Range: 0.05-5.0 μm
Uniformity: ±5% thickness variation
Quality Specifications
Porosity: Zero pinholes at 0.1 μm
Adhesion: Excellent on Ni underlayer
Solderability: Superior wetting properties
Wire Bondability: Excellent for electronics
Bath Stability
Bath Life: 6 months continuous use
Metal Turnover: 4-6 times per year
Contamination Tolerance: Low organic sensitivity
Replenishment: Automatic dosing compatible

Performance Characteristics

Detailed performance metrics demonstrate Electroless Gold Plating superiority in precision applications with exceptional deposit quality, uniform thickness, and outstanding electronic properties.

Deposit Purity

Purity: 99.9% Au minimum achieved

Exceptional gold deposit quality
Thickness Control

Uniformity: ±5% variation across surface

Superior thickness consistency
Electronic Properties

Conductivity: Excellent electrical performance

Optimal for electronics applications
Operating Window

Temperature: 85-95°C stable operation

Consistent process conditions
Bath Longevity

Stability: 6 months continuous operation

Extended production runs
Adhesion Quality

Bond strength: Excellent substrate adhesion

Reliable coating integrity

Safety Information

Contains formaldehyde and alkaline chemicals - potential carcinogen and severe caustic hazard. Use appropriate protective equipment including chemical-resistant gloves, safety goggles, and lab coats. Ensure excellent ventilation and fume extraction. Handle with proper training and emergency procedures for chemical exposure.

Carcinogenic
Caustic Burn
Vapor Hazard

Storage & Handling

Store components separately in original containers in a cool, well-ventilated area away from heat and incompatible materials. Mix bath solutions in designated electroplating areas with proper fume extraction. Maintain bath temperature and pH within specified ranges. Use automated dosing systems for consistent performance.

Temperature controlled (15-25°C)
Fume extraction required
Separate component storage
Automated dosing recommended

Chemical Mechanisms & Reaction Pathways

Electroless Gold Plating exhibits complex autocatalytic reduction mechanisms through controlled chemical reactions, enabling uniform gold deposition without external current for precision electronic applications.

Autocatalytic Reduction

Au³⁺ + 3e⁻ → Au⁰ catalyzed by deposited gold surface

Self-sustaining deposition process
Chemical Reducing Agent

Controlled electron donation for continuous gold reduction

Uniform thickness control
Surface Activation

Catalytic surface preparation for initiation

Excellent adhesion foundation
Complex Stability

pH and temperature controlled gold complex stability

Consistent plating performance

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global electronics industry access with complete documentation supporting international electroless plating and electronic assembly standards.

IPC Standards

Electronics industry electroless plating specifications

ASTM B733

Standard specification for autocatalytic nickel-phosphorus coatings

RoHS Compliance

Lead-free electronics manufacturing compliance

REACH Registration

European Union chemical regulation compliance

Process Validation

Supported electroless plating process documentation

SDS Documentation

Multi-language Safety Data Sheets (GHS compliant)

Technical Support & Value-Added Services

DRAVYOM's electroless plating specialists provide comprehensive gold plating support, process optimization, and technical services for precision electronics manufacturing.

Process Development
  • Bath chemistry optimization
  • Temperature profile development
  • Surface preparation protocols
  • Custom chemistry formulation
Analytical Services
  • Coating thickness measurement
  • Porosity testing
  • Adhesion evaluation
  • Solderability testing
Technical Support
  • Electroless plating troubleshooting
  • Equipment optimization
  • Quality control protocols
  • Electronics manufacturing best practices
Supply Solutions
  • Production scheduling
  • Emergency supply arrangements
  • Custom concentrations
  • Electronics industry distribution

Environmental Impact & Sustainability

Our Electroless Gold Plating production emphasizes environmental responsibility through sustainable electroless chemistry, precious metal recovery, and comprehensive environmental management.

Gold Recovery

Advanced precious metal recovery and recycling systems

Water Conservation

Closed-loop rinse water treatment and recycling

Process Efficiency

Optimized bath life and chemical utilization

RoHS Compliance

Lead-free and environmentally safe formulations

Green Electronics

Supports sustainable electronics manufacturing

Container Recovery

Specialized precious metal container recycling

Manufacturing Excellence & Quality Control

DRAVYOM's electroless plating facility employs advanced chemical technology to ensure consistent gold plating quality for critical electronics applications.

Chemical Processing

Precision autocatalytic chemistry in controlled environments

Optimal reducing agent and stabilizer balance
Quality Testing

Comprehensive coating performance and reliability testing

Thickness uniformity and adhesion validation
Quality Systems

ISO 9001:2015 certified electronics-grade production

Continuous improvement and validation
Secure Storage

Temperature-controlled precious metal chemistry storage

Maintained solution stability and performance

Market Applications & Performance Data

Comprehensive electronics manufacturing data demonstrating Electroless Gold Plating effectiveness across diverse applications with quantified performance metrics.

Electronics Manufacturing
Thickness: 0.1-5.0 μm controllable range Uniformity: ±10% thickness variation Solderability: Excellent performance retention
Connector Industry
Applications: 500+ connector specifications Reliability: 99% electrical performance Durability: Extended contact life
Semiconductor Packaging
Bondability: Wire bonding compatible Corrosion: Superior protection in harsh environments Yield: 95%+ first-pass success rate

DRAVYOM Competitive Advantages

Superior Uniformity

Exceptional thickness control and coverage uniformity on complex electronic components

Reliable Supply

Guaranteed availability with electronics industry expertise and precious metal supply chain

Electroless Expertise

Specialized electroless chemistry team provides process optimization and troubleshooting

Quality Assurance

Comprehensive testing with electronics performance validation and reliability documentation

Global Standards

International compliance with electronics and precious metal plating standards

Partnership Approach

Collaborative relationships with electronics manufacturers and custom chemistry development