Copper Sulphate
Electroplating Copper
Electroplating Grade

Copper Sulphate

Electroplating grade Copper Sulphate manufactured for copper electroplating, electroforming, and printed circuit board manufacturing. Our high-purity copper salt provides excellent conductivity and uniform deposit formation for electronics applications and decorative copper plating.

  • Electroplating Grade Purity
  • PCB Manufacturing
  • Copper Electroforming
  • Electronics Industry
  • High Conductivity
  • Uniform Deposition

Technical Specifications

Chemical Formula: CuSO₄·5H₂O
CAS Number: 7758-99-8
EINECS Number: 231-847-6
Assay (as CuSO₄·5H₂O): 98.0-102.0%
Physical State: Blue crystalline powder
Density (20°C): 2.284 g/cm³
Molecular Weight: 249.68 g/mol
Solubility in Water (20°C): 209 g/L
pH (5% solution): 3.7-4.5
Copper Content: 25.0-25.5%
Iron (Fe): ≤ 0.005%
Nickel (Ni): ≤ 0.005%
Chloride (Cl): ≤ 0.001%
Insoluble Matter: ≤ 0.005%
Conductivity Enhancement: Superior electrodeposition
UN Number: Not regulated
Packaging Options: 25kg, 50kg HDPE bags

Applications

PCB Manufacturing
Copper Electroplating
Electronics Industry
Copper Electroforming
Decorative Plating
Conductive Coatings
Automotive Parts
Tool Manufacturing
Consumer Electronics
RF Components
Battery Terminals
Analytical Standards

Industry-Specific Grades

DRAVYOM offers specialized copper sulphate grades tailored for specific electroplating requirements, ensuring optimal performance and regulatory compliance across diverse industrial applications.

Electronics Grade
Assay: 99.0-101.0% Iron: ≤ 0.002% Nickel: ≤ 0.002% Application: PCB manufacturing, semiconductor
Electroplating Grade
Assay: 98.0-102.0% Copper Content: 25.0-25.5% Chloride: ≤ 0.001% Application: General copper plating
Decorative Grade
Assay: 98.5-101.5% Brightness: High luster finish Uniformity: Excellent deposit quality Application: Decorative copper finishes
Industrial Grade
Assay: 97.0-103.0% Bulk Packaging: Available Cost-Effective: High volume applications Application: Large-scale electroplating

Quality Standards

DRAVYOM's Copper Sulphate is manufactured under stringent quality control protocols, meeting international electroplating standards including IPC, ASTM, and electronics industry specifications. Our electroplating-grade production ensures consistent performance and regulatory compliance.

ISO 9001:2015 Certified Manufacturing
IPC Standards Compliance
98-102% Accurate Assay
Advanced Purity Testing
Superior Conductivity
Batch-to-Batch Consistency
Complete Certificate of Analysis
Moisture-Protected Packaging

Advanced Chemical Properties & Performance

Electroplating Grade Copper Sulphate exhibits exceptional electrochemical properties essential for copper plating applications. Its ultra-pure composition and precise crystalline structure ensure reliable performance in demanding electroplating processes and metal finishing operations.

Electrochemical Properties
Standard Electrode Potential: +0.34 V (Cu²⁺/Cu)
Ionic Conductivity: High Cu²⁺ mobility
Cathodic Efficiency: 95-98% copper deposition
Current Density Range: 10-50 ASF optimal
Physical Properties
Crystal Structure: Triclinic pentahydrate
Density (20°C): 2.284 g/cm³
Solubility (20°C): 203 g/L in water
pH (5% solution): 3.7-4.5
Plating Performance
Deposit Quality: Bright, uniform copper layers
Throwing Power: Excellent coverage uniformity
Leveling Ability: Superior surface smoothness
Adhesion Strength: ≥ 25 N/cm² bond strength
Purity Specifications
Copper Content: 25.0-25.5% Cu
Iron (Fe): ≤ 0.001%
Nickel (Ni): ≤ 0.0005%
Lead (Pb): ≤ 0.0002%
Stability Properties
Shelf Life: 3 years (unopened)
Thermal Stability: Stable up to 150°C
Solution Stability: Stable in acidic conditions
Container Compatibility: Plastic, glass containers

Performance Characteristics

Detailed performance metrics demonstrate Electroplating Grade Copper Sulphate superiority in metal finishing applications with exceptional plating efficiency, deposit quality, and operational reliability across diverse electroplating processes and industrial applications.

Plating Efficiency

Efficiency: 95-98% copper deposition rate

Superior electrochemical performance
Deposit Uniformity

Thickness variation: ±5% across substrate

Exceptional coating consistency
Surface Quality

Surface roughness: Ra ≤ 0.1 μm achievable

Premium finish characteristics
Operating Range

Temperature range: 18-35°C optimal

Versatile process conditions
Batch Consistency

Variation: ±2% copper content between lots

Outstanding production reliability
Solution Longevity

Bath life: 6-12 months with proper maintenance

Extended operational stability

Safety Information

Copper Sulphate is harmful if swallowed and may cause eye and skin irritation. Use appropriate protective equipment including chemical-resistant gloves, safety goggles, and protective clothing. Ensure adequate ventilation in work areas and follow proper handling procedures to prevent inhalation of dust or contact with skin and eyes.

Harmful
Eye Irritant
Skin Irritant

Storage & Handling

Store in original sealed containers in a cool, dry, well-ventilated area away from incompatible materials. Keep containers tightly closed and protect from moisture to prevent caking. Use appropriate material handling equipment and ensure proper dust control measures during transfer operations.

Cool, dry storage (15-30°C)
Adequate ventilation required
Original sealed containers
Moisture protection essential

Chemical Mechanisms & Reaction Pathways

Copper Sulphate exhibits complex copper ion chemistry through controlled hydration and electrochemical reduction mechanisms, enabling precise copper deposition and surface treatment with predictable plating characteristics.

Hydration Chemistry

CuSO₄·5H₂O ⇌ Cu²⁺ + SO₄²⁻ + 5H₂O (complete dissociation)

Controlled copper ion release for plating
Electrochemical Reduction

Cu²⁺ + 2e⁻ → Cu (cathodic copper deposition)

Predictable plating rate at controlled potential
Complex Formation

Copper-ligand complexes for enhanced bath stability

Improved deposit quality and throwing power
pH Buffering

Hydrolysis equilibrium control for stable plating conditions

Consistent copper deposition characteristics

Regulatory Compliance & Documentation

Comprehensive regulatory compliance ensures global electroplating industry access with complete documentation packages supporting international standards and copper plating method validations.

Electroplating Standards

ASTM B734 and IPC specifications for copper electroplating

Industrial Grade Certification

Technical grade specifications for metal finishing applications

EPA Compliance

Environmental regulations for copper discharge and wastewater

REACH Registration

European Union chemical regulation compliance for copper compounds

RoHS Compliance

Electronics industry standards for copper plating applications

Water Quality Standards

Drinking water and environmental copper monitoring protocols

Technical Support & Value-Added Services

DRAVYOM's electroplating specialists provide comprehensive copper plating support, troubleshooting assistance, and bath optimization to maximize Copper Sulphate performance in your specific applications.

Bath Optimization
  • Copper concentration optimization protocols
  • pH and conductivity adjustment guidance
  • Additive selection and dosing strategies
  • Temperature control optimization
Plating Process Support
  • Current density optimization studies
  • Deposit thickness uniformity analysis
  • Surface quality troubleshooting
  • Throwing power enhancement techniques
Technical Support
  • Electroplating troubleshooting consultation
  • Safe handling and dilution training
  • Process transfer and scale-up support
  • Quality control testing protocols
Supply Solutions
  • Consistent high-purity copper salt supply
  • Emergency replenishment services
  • Custom concentration solutions
  • Global distribution network

Environmental Impact & Sustainability

Our Copper Sulphate production emphasizes environmental responsibility through sustainable copper recovery, wastewater treatment optimization, and comprehensive environmental impact management for electroplating operations.

Copper Recovery

Advanced electrowinning systems for copper waste recovery

Wastewater Treatment

Copper removal and water recycling programs

Clean Production

Energy-efficient crystallization with emission controls

Safe Disposal

Comprehensive copper waste neutralization guidance

ISO 14001

Environmental management system certified production

Green Chemistry

Sustainable copper salt manufacturing processes

Manufacturing Excellence & Quality Control

DRAVYOM's advanced electroplating chemical manufacturing facility employs controlled crystallization technology with continuous monitoring systems to ensure consistent Copper Sulphate quality and performance across all production batches.

Production Process

Controlled crystallization from high-purity copper solutions

Precise hydration control and purity optimization
Quality Testing

18-point analytical testing protocol including copper content and trace metals

ICP-AES verification and conductometric analysis
Quality Systems

ISO 9001:2015 quality management with electroplating laboratory validation

Continuous improvement and plating method validation
Packaging Control

Moisture-resistant containers with contamination prevention systems

Chemical stability and hydration maintenance

Market Applications & Performance Data

Comprehensive electroplating data demonstrating Copper Sulphate effectiveness across diverse applications with quantified performance metrics and plating method validations.

Electronics Manufacturing
Deposit Quality: 99.8% uniformity Throwing Power: 85%+ coverage Conductivity: <2μΩ·cm resistivity
Decorative Plating
Surface Finish: Ra <0.2μm smoothness Adhesion: >15 N/mm² bond strength Brightness: 90%+ reflectivity retention
Automotive Applications
Corrosion Resistance: 500+ hour salt spray Thickness Control: ±5% uniformity Production Rate: 40% faster processing

DRAVYOM Competitive Advantages

Superior Copper Purity

Consistently exceeds industry specifications with exceptional copper content and minimal impurities for electroplating applications

Reliable Supply

Guaranteed availability with strategic inventory management and electroplating-grade production scheduling

Plating Expertise

Dedicated electroplating team provides copper bath optimization and troubleshooting support

Quality Assurance

Comprehensive certificates with analytical data and plating method validation support

Global Standards

International compliance with ASTM, IPC, and RoHS specifications for worldwide acceptance

Partnership Approach

Collaborative relationships with electroplating facilities and custom bath development services